標準編號:	GB/T 5230-2020
中文名稱:	印制板用電解銅箔
英文名稱:	Electrodeposited copper foil for printed board
中標分類:	H62    重金屬及其合金
行業分類:	GB    國家標準
ICS分類:	77.150.30 77.150.30    銅產品 77.150.30
發布機構:	國家市場監督管理總局 國家標準化管理委員會
發布日期:	2020-09-29
實施日期:	2021-8-1
標準狀態:	valid
替代舊標準:	GB/T 5230-1995 電解銅箔
翻譯語言:	英文
文件格式:	PDF
中文字符數:	21000 字
翻譯價格(元):	1470.0
交付時間:	付款后 1 個工作日

Codeofchina.com is in charge of this English translation. In case of any doubt about the English translation, the Chinese original shall be considered authoritative. This standard is drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces GB/T 5230-1995 Electrodeposited copper foil. The following main technical changes have been made with respect to GB/T 5230-1995: ——Terms and definitions such as "elongation", "foil profile", "smooth side", and "matte side" are added (see Clause 3). ——The models are added in the quantity from 2 to 5 (see 4.1; Table 1 of the 1995 edition). ——Designation and labeling of copper foil are added (see 4.2 and 4.3). ——As for the deviation of length and width of copper foil sheets, the provision text "agreed by the supplier and the purchaser" is revised to "as specified in the procurement documents, with the allowable deviation of mm for the length and mm for the width or as agreed by the supplier and the purchaser" (see 5.2.1; 5.2.2.2 of the 1995 edition). ——The width deviation of copper foil roll is modified from 4 width ranges to "as specified in the procurement documents, and the allowable deviation of the width shall be mm or as agreed by the supplier and the purchaser" (see 5.2.2; Table 3 of the 1995 edition). ——The specifications of mass per unit area and thickness are added in quantity from 11 to 16, and the allowable deviation of mass per unit area includes "high precision" level (see Table 3; Table 2 of the 1995 edition). ——The requirements on profile type and profile of copper foils are added (see Table 4). ——The requirements on surface roughness of copper foils are modified (see 5.2.6; 5.7.3 of the 1995 edition). ——The requirements on physical properties of copper foils are modified (see Table 5; 5.3 of the 1995 edition). · E-01 copper foil: the tensile strength and elongation indexes for the copper foils with a thickness of 9μm and 12μm are added; compared with the former standard, the tensile strength and elongation indexes the copper foils with a thickness of 18μm, 35μm and 70μm are raised; the specific properties indexes the copper foils with a thickness of 25μm are deleted and amended to "agreed by the supplier and the purchaser". · E-02 copper foil: the tensile strength and elongation indexes for the copper foils with a thickness of 12μm are added; compared to the former standard, the tensile strength indexes for the copper foils with a thickness of 18μm, 35μm and 70μm foil are raised. · The tensile strength and elongation indexes for E-03, E-04 and E-05 copper foils are added, and the fatigue ductility index for E-05 foil is added. ——The requirements on "etchability," "chemical cleanability," "treatment transfer", "high temperature oxidation resistance" and "purity" are added(see 5.4.1, 5.4.2, 5.4.4, 5.4.5, 5.5). ——The requirement on mass resistivity for the copper foils with a thickness of 15μm is added (see Table 6). ——The modification is made to Clause 7 (Inspection rules): the inspection classification, test conditions, appraisal inspection and quality conformance inspection items, sampling and judgement are added (see Clause 7). ——Annex A (Informative) "Comparison of electrodeposited copper foil models between this standard and foreign standards" is added (see Annex A). ——Annex B (Normative) "Test methods for diameter and quantity of copper powder" is added (see Annex B). ——Annex C (Normative) "Measurement method of warpage of copper foil" is added (see Annex C). ——The seven annexes of GB/T 5230-1995 are deleted (see Annexes A, B, C, D, E, F and G of the 1995 edition). This standard was proposed by China Nonferrous Metals Industry Association. This standard is under the jurisdiction of SAC/TC 243 National Technical Committee on Nonferrous Metals of Standardization Administration of China. ? The previous editions of the standard are as follows: ——GB/T 5230-1985 and GB/T 5230-1995. Electrodeposited copper foil for printed board 1 Scope This standard specifies the classification, designation and labeling, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, as well as quality certificates and order form (or contract) content of electrodeposited copper foils for printed board. This standard is applicable to electrodeposited copper foils for printed board (hereinafter referred to as "copper foil"). 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced documents (including any amendments) applies. GB/T 2036 Terms for printed circuits GB/T 8888 Wrough heavy non-ferrous metal products - Packing, marking, transportation, storing and certificate of quality GB/T 29847-2013 Test methods for copper foil used for printed boards 3 Terms and definitions For the purposes of this standard, the terms and definitions given in GB/T 2036 and the following apply. 3.1 elongation ratio (expressed by percent) of the distance increment between the effective part markers of the specimen to that between the initial markers when the specimen breaks under tensile load [GB/T 31471-2015, Definition 3.1] 3.2 foil profile unevenness of a copper foil surface caused by processing and/or enhanced bonding treatment [GB/T 31471-2015, Definition 3.4] 3.3 arithmetical mean deviation of the profile Ra arithmetic mean of the absolute distances from the center line to the rough profile within the measured length [GB/T 31471-2015, Definition 3.5] 3.4 ten point height of irregularities Rz sum of the 5 largest profile peak height averages and the 5 largest profile valley depth averages within the sampled length 3.5 smooth side cathode surface, i.e. the side of an electrodeposited copper foil close to the cathode roll [GB/T 31471-2015, Definition 3.7] 3.6 matte side the other side corresponding to the smooth side of an electrodeposited copper foil [GB/T 31471-2015, Definition 3.8] 3.7 treatment transfer enhancing binder transferred from the copper foil roughening treatment surface to the laminate substrate 3.8 carrier support medium used to make thin or soft copper foils easy to process and use 3.9 copper foil with releasable carrier copper foil produced by electrodeposition method using a carrier as a cathode Note: copper foils with releasable carrier are mainly classified into etchable ones and detachable ones. 3.10 pinhole light-transmitting micro holes through a copper foil 3.11 penetrating point opaque pores 3.12 warpage degree of bending of a copper foil specimen relative to the horizontal surface, characterized by the maximum vertical distance (mm) between the warped surface and the horizontal surface 4 Classification, designation and labeling 4.1 Classification Copper foils are classified into 5 types by their characteristics, and their models and characteristics are shown in Table 1. Table 1 Models and characteristics of copper foils Model Characteristic E-01 Standard electrodeposited copper foil E-02 High-elongation electrodeposited copper foil E-03 High-temperature-elongation electrodeposited copper foil E-04 Annealable electrodeposited copper foil E-05 Low-temperature-annealable electrodeposited copper foil Note: the comparison table of electrodeposited copper foil models between this standard and foreign standards is detailed in Annex A. 4.2 Designation 4.2.1 Types of enhancing bonding treatment for copper foils The types of enhancing bonding treatments for copper foils may include: a) non-enhancing bonding treatment without anti-oxidation treatment, denoted by N; b) non-enhancing bonding treatment with dual-side anti-oxidation treatment, denoted by P; c) enhancing bonding treatment of matte side (anodic side) with dual-side anti-oxidation treatment, denoted by A; d) enhancing bonding treatment of both sides with dual-side anti-oxidation treatment, denoted by D; e) enhancing bonding treatment of smooth side (cathode side) with dual-side anti-oxidation treatment, denoted by R.

Foreword i 1 Scope 2 Normative references 3 Terms and definitions 4 Classification, designation and labeling 4.1 Classification 4.2 Designation 4.3 Labeling 5 Technical requirements 5.1 Appearance quality 5.2 Dimensions and their allowable deviations 5.3 Physical properties 5.4 Processing property 5.5 Purity 5.6 Mass resistivity 6 Test methods 6.1 Appearance quality 6.2 Dimensions and their allowable deviations 6.3 Physical properties 6.4 Processing properties 6.5 Purity 6.6 Mass resistivity 7 Inspection rules 7.1 Inspection and acceptance 7.2 Inspection classification 7.3 Test conditions 7.4 Appraisal inspection (type inspection) 7.5 Quality conformance inspection 8 Marking, packaging, transportation, storage and quality certificate 8.1 Marking 8.2 Packaging 8.3 Transportation, storage and quality certificate 9 Order form (or contract) contents Annex A (Informative) Comparison of electrodeposited copper foil models between this standard and foreign standards Annex B (Normative) Test methods for diameter and quantity of copper powder Annex C (Normative) Measurement method of warpage of copper foil Bibliography

印制板用電解銅箔 1 范圍 本標準規定了印制板用電解銅箔的分類、代號及標記、技術要求、試驗方法、檢驗規則及標志、包裝、運輸、貯存、質量證明書及訂貨單(或合同)內容。 本標準適用于印制板用電解銅箔(以下簡稱“銅箔”)。 2 規范性引用文件 下列文件對于本文件的應用是必不可少的。凡是注日期的引用文件，僅注日期的版本適用于本文件。凡是不注日期的引用文件，其最新版本(包括所有的修改單)適用于本文件。 GB/T 2036 印制電路術語 GB/T 8888 重有色金屬加工產品的包裝、標志、運輸、貯存和質量證明書 GB/T 29847—2013 印制板用銅箔試驗方法 3 術語和定義 GB/T 2036界定的以及下列術語和定義適用于本文件。 3.1 延伸率 elongation 試樣在拉伸負荷下斷裂時，試樣有效部分標線間的距離增量與初始標線間距離之比的百分率。 [GB/T 31471—2015，定義3.1] 3.2 輪廓度 foil profile 由加工和(或)增強粘結處理引起銅箔表面的不平整度。 [GB/T 31471—2015，定義3.4] 3.3 輪廓算術平均偏差 arithmetical mean deviation of the profile Ra 在測量長度內，從中心線至粗糙輪廓所有絕對距離的算術平均值。 [GB/T 31471—2015，定義3.5] 3.4 微觀不平度10點高度 ten point height of irregularitties Rz 在取樣長度內，5個最大的輪廓峰高平均值與5個最大的輪廓谷深平均值之和。 3.5 光面 smooth side 陰極面，即電解銅箔貼近陰極輥的面。 [GB/T 31471—2015，定義3.7] 3.6 粗糙面 matte side 與電解銅箔光面相對應的另一面。 [GB/T 31471—2015，定義3.8] 3.7 處理轉移物(處理完善性) treatment transfer 從銅箔粗化處理面轉移到層壓板基材上的增強粘結物。 3.8 載體 carrier 用來使薄或軟的銅箔容易加工和使用的支撐介質。 3.9 載體銅箔 copper foil with releasable carrier 用載體作為陰極，采用電沉積方法生產的銅箔。 注：載體銅箔主要分為可蝕刻載體銅箔和可分離載體銅箔。 3.10 針孔 pinhole 貫穿銅箔的透光微孔。 3.11 滲透點 penetrating point 不透光的孔隙。 3.12 翹曲度 warpage 銅箔試樣相對于水平面的彎曲程度，用翹起面與水平面之間最大垂直距離(mm)表征。 4 分類、代號及標記 4.1 分類 銅箔按特性不同分為5種，型號及特性見表1。 表1 銅箔型號和特性 型 號 特性 E-01 標準電解銅箔 E-02 高延伸性電解銅箔 E-03 高溫延伸性電解銅箔 E-04 可退火電解銅箔 E-05 可低溫退火電解銅箔 注：國內外電解銅箔型號對照參見附錄A。 4.2 代號 4.2.1 銅箔的增強粘結處理類型 銅箔的增強粘結處理類型可分為： a) 未經增強粘結處理，不防氧化，用N表示； b) 未經增強粘結處理，雙面防氧化，用P表示； c) 粗糙面(陽極面)增強粘結處理，雙面防氧化，用A表示； d) 雙面增強粘結處理，雙面防氧化，用D表示； e) 光面(陰極面)增強粘結處理，雙面防氧化，用R表示。 4.2.2 輪廓度 輪廓度用Ra和Rz表征，Ra用于表示銅箔光面(陰極面)的粗糙度或輪廓度，Rz用于表示粗糙面(陽極面)的輪廓度或粗糙度。銅箔粗糙面輪廓度類型代號如下(輪廓度參數見表4)： a) 未經處理或粗化用X表示； b) 標準輪廓，用S表示； c) 低輪廓，用L表示； d) 甚低輪廓，用V表示； e) 極低輪廓(平滑輪廓)，用HV表示。 4.2.3 質量保證等級 銅箔按照質量保證水平差異分為三個等級，分別用代號1、2、3標識，如果訂貨未指明等級，則為1級。質量保證等級適用性如下： a) 1級：適用于要求電路功能完整，機械性能和外觀缺陷不重要的應用場合； b) 2級：適用于電路設計、工藝合格率及一致性要求允許局部區域不一致的應用場合； c) 3級：適用于要求質量保證等級最高的應用場合。 4.3 標記 銅箔的標記用型號、名義厚度、粘結增強處理、輪廓度及質量保證等級代號標記。標記圖示如下： 質量保證等級(見4.2.3) 輪廓度(見4.2.2) 增強粘結處理類型(見4.2.1) 名義厚度(見表3) 銅箔型號(見表1) 示例： 標準電解銅箔、厚度18μm、未經增強粘結處理、雙面防氧化、未經處理或粗化、標準輪廓、質量保證等級為2級的銅箔，標記為： E-01/18/P/XS/2 5 技術要求 5.1 外觀質量 5.1.1 凹點和壓痕 銅箔表面允許的凹點和壓痕應符合表2規定。 表2 銅箔表面允許的凹點和壓痕 質量保證等級 要求 凹點和壓痕直徑 凹點和壓痕/個 1級，2級3級 ＞1.0 mm 0 ≤1.0 mm ≤2 不大于銅箔標稱厚度的5％ 忽略不計 ＞0.38 mm 0 ≤0.38 mm ≤2 不大于銅箔標稱厚度的5％ 忽略不計 5.1.2 皺折 銅箔不應有永久變形性的皺折。 5.1.3 劃痕 銅箔劃痕深度不應超過銅箔標稱厚度20％；每300 mm×300 mm區域，劃痕數不應超過3條；對深 度小于銅箔標稱厚度5％的劃痕可忽略不計。 5.1.4 缺口和撕裂 銅箔邊緣不應有缺口和撕裂。 5.1.5 針孔和孔隙度(滲透點) 銅箔的針孔和孔隙度應符合以下規定： a) 標稱厚度小于17.1μm銅箔，針孔和孔隙度個數由供需雙方商定； b) 標稱厚度等于17.1μm銅箔，每300 mm×300 mm區域，針孔和孔隙度不應超過3個； c) 標稱厚度大于17.1 μm銅箔，每300 mm×300 mm區域，針孔和孔隙度不應超過1個。 5.1.6 其他 5.1.6.1 一般外觀 銅箔面不應有灰塵、污物、腐蝕、鹽類、油脂、指印、外來物等影響銅箔使用壽命、加工性能的外觀缺陷，允許有不同表面處理方法引起的不影響銅箔使用的顏色差異。 5.1.6.2 銅粉 卷箔(或片箔)端面允許的銅粉最大直徑和數量由供需雙方商定。 5.2 尺寸及其允許偏差 5.2.1 片狀銅箔的長度和寬度 片狀銅箔的長度(L)和寬度(W)應按采購文件規定，長度允許偏差為 mm，寬度允許偏差為 mm或由供需雙方商定。 5.2.2 卷狀銅箔的寬度 卷狀銅箔的寬度(W)應按采購文件規定，寬度允許偏差為 mm或由供需雙方商定。 5.2.3 厚度 5.2.3.1 按6.2.3測定單位面積質量時，包括任何處理在內，各型號銅箔總厚度應符合表3規定。 5.2.3.2 銅箔的最小厚度應不小于表3規定標稱厚度值的90％，最大厚度應不超過銅箔最大輪廓度(見5.2.5)與表3規定銅箔標稱厚度110％之和；標準輪廓度銅箔，無最大厚度要求。 5.2.4 單位面積質量 包括任何處理在內，各型號銅箔單位面積質量及其允許偏差應符合表3規定。單位面積質量小于75.9 g/m2(標稱厚度9 μm)的銅箔可帶有載體(包括可分離載體和可蝕刻載體)。 表3 銅箔單位面積質量和厚度a 銅箔代碼 名義厚度b μm 單位面積質量b g/m2 標稱厚度b μm 單位面積質量允許偏差 g/m2 普通精度 較高精度 高精度 E 5 45.1 5.1 ±10％ ±5％ ±3％ Q 9 75.9 8.5 T 12 106.8 12.0 J 15 133.9 15.0 H 18 152.5 17.1 M 25 228.8 25.7 1 35 305.0 34.3 W 50 445.0 50.0 2 70 610.0 68.6 3 105 915.0 102.9 4 140 1 220.0 137.2 5 175 1 525.0 171.5 6 210 1 830.0 205.7 7 245 2 135.0 240.0 10 350 3 050.0 342.9 14 490 4 270.0 480.1 注：銅箔以單位面積質量供貨，名義厚度只作為規格的代稱。標稱厚度是根據銅箔單位面積質量計算所得。銅箔代碼根據IPC 4562而來，和名義厚度對應。 a 未列入本表的銅箔，單位面積質量和厚度由供需雙方商定。 b 名義厚度每增加35 μm，單位面積質量增加305 g/m2，標稱厚度增加34.3 μm。 5.2.5 輪廓度 當按6.2.4測定時，銅箔的輪廓度以微觀不平度10點高度來表征，應符合表4規定。 表4 銅箔輪廓度 輪廓度類型 微觀不平度10點高度Rz，不大于 μm S——標準輪廓 不適用 L——低輪廓 10.2 V——甚低輪廓 5.1 HV——極低輪廓 3.0 X——未處理或粗化 由供需雙方商定 5.2.6 表面粗糙度 表面粗糙度要求適用于未經處理電解銅箔的光面(陰極面)，當按6.2.4測定時，表面粗糙度以輪廓算術平均偏差來表征，其Ra應不大于0.43 μm。 5.2.7 翹曲度 銅箔的翹曲度要求由供需雙方商定。 5.3 物理性能 5.3.1 抗拉強度 按6.3.1檢驗時，抗拉強度應符合表5規定。 5.3.2 疲勞延展性 按6.3.2檢驗時，疲勞延展性應符合表5規定。 5.3.3 延伸率 按6.3.3檢驗時，延伸率應符合表5規定。 5.3.4 剝離強度 按6.3.4檢驗時，剝離強度應符合供需雙方的規定。 5.3.5 載體分離強度 按6.3.5檢驗時，銅箔與載體(膜或箔)分離強度應由供需雙方商定。